Join Emerson experts in booth N-4736 at this year’s PACK EXPO Conference in Chicago October 23rd - 26th. Learn how we can help you maximize your production and digitally transform your factory.
Experience the latest innovation in automation technology at this year’s PACK EXPO. Emerson’s experts can help you meet ambitious sustainability and energy efficiency goals, assist with preventative or predictive maintenance to reduce downtime, and improve your OEE and productivity and improve the efficiency and effectiveness of your Clean-in-Place systems.
Connect With Our Fluid Control & Pneumatics Experts
Connect With Our Welding, Assembly & Cleaning Experts
Connect With Our Leak Detection Experts
Connect With Our Automation Control Experts
Join this Emerson sponsored breakfast where you will hear from keynote speaker Dawn Hudson, former Chief Marketing Officer at the National Football League and Former President and CEO of Pepsi Cola North America, on her experiences in the workforce.
Clean-in-Place (CIP) processes are vital to hygienic practices, but they can also be a source of inefficiencies, leading to high utility costs and wasted product. Selecting the correct instrumentation can help to optimize your CIP process and reduce overall operating costs. In this workshop we will discuss seven common CIP efficiency challenges along with seven solutions in the form of proper measurement instrumentation.
In this fun and educational event sponsored by Emerson, teams of university students from across the U.S. race around the show floor to complete tasks at the booths of participating exhibitors.
Coming Soon
Deliver more precisely, operate more efficiently, and consume less energy while safely moving your packaging from the design table to consumers.
Global Marketing Communications Manager
Emerson Automation Solutions
203-796-0571
Global PR & Communications
Emerson Automation Solutions
+495112136865
